Housing construction

ABSTRACT

A structure can include a body having a first surface and a second opposing surface. The three-dimensional structure can include the body defining a first pattern of first cavities extending into the body from the first surface and the body defining a second pattern of second cavities extending into the body from the second surface. One or more first cavities can eccentrically intersect with one or more second cavities to define a pattern of apertures in the body.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Patent ApplicationNo. 62/736,299, filed 25 Sep. 2018, and entitled “HOUSING CONSTRUCTION,”the entire disclosure of which is hereby incorporated by reference.

FIELD

The described embodiments relate generally to three-dimensionalstructures. More particularly, the present embodiments relate tothree-dimensional structures forming components for electronics devices.

BACKGROUND

The components of an electronic device, for example a housing of anelectronic device, may include three-dimensional structures havingfeatures tailored to the specific purposes for which they are employed.The components of an electronic device may be configured to providephysical support or protection to other components of the electronicdevice, provide for thermal transmission, provide for airflow through oraround the electronic device, or provide for one or more various otherpurposes. Additionally, the components of the electronic device may bedesigned to provide a unique and pleasing look and feel for a user.

Recent advances in electronic devices have enabled high levels ofperformance. Existing components and structures for electronic devices,however, may limit the levels of performance of such devices. Forexample, an existing housing may limit the performance of an electronicdevice because of an inability to effectively distribute or reject heatgenerated by the electronic device to the surrounding environment. Inthis regard, further tailoring of components for electronic devices toprovide additional or enhanced functionality and pleasing aestheticfeatures may be desirable.

SUMMARY

One aspect of the present disclosure relates to an electronic deviceincluding a body having a first surface and a second surface oppositethe first surface, a first pattern of first cavities extending into thebody from the first surface, a second pattern of second cavitiesextending into the body from the second surface, one or more secondcavities of the second pattern of cavities intersecting with one or morefirst cavities of the first pattern of cavities to form a pattern ofapertures in the body.

In some embodiments, the pattern of apertures can extend substantiallyacross an entire width of the body and include at least two regionsseparated by a portion of the body that does not include the pattern ofapertures. One or more of the first or second pattern of first or secondcavities can be a repeating pattern of cavities. The first cavities ofthe first pattern of cavities can be substantially a same size as thesecond cavities of the second pattern of cavities. The first and secondcavities of the first and second patterns can be substantially sphericalor hemispherical. The first and second cavities of the first and secondpatterns can be substantially positioned in a close-packed arrangement.The first and second cavities of the first and second patterns can besubstantially positioned in a hexagonally close-packed arrangement. Thebody can conduct heat away from a component of the electronic devicepositioned substantially adjacent to the first surface of the body. Thebody can have a thickness of less than about 15 mm. The body can includea metal.

Another aspect of the present disclosure relates to a housing for anelectronic device including a body having a first surface and a secondsurface, a first cavity extending into the body from the first surface,and a second cavity extending into the body from the second surface andeccentrically intersecting with the first cavity to form a pattern inthe body.

In some embodiments, the first cavity can be substantially a same shapeas the second cavity. The first cavity and the second cavity can besubstantially spherical or hemispherical. The pattern in the body caninclude a through-hole. The body can form at least a portion of ahousing for an electronic device. The body can include a metal, aceramic, a polymer, a composite material, or combinations thereof. Thehousing can define an internal volume configured to surround one or morecomponents of the electronic device.

According to another aspect of the present disclosure, an electronicdevice can include a body having a first surface and a second surfaceopposite the first surface, the body including a first repeating patternof substantially spherical or hemispherical first cavities extendinginto the body from the first surface, a second repeating pattern ofsubstantially second spherical or hemispherical cavities extending intothe body from the second surface, wherein at least one second cavity ofthe second repeating pattern of cavities eccentrically interferes withat least one first cavity of the first repeating pattern of firstcavities to form a matrix of continuous passageways in the body. Thematrix of continuous passageways can extend substantially across anentire width of the body and have at least two regions separated by aportion of the body that does not include the matrix of continuouspassageways. Furthermore, the electronic device can have a flangesurrounding and extending away from the first surface, the flange caninclude a mounting surface and a display mounted on the mounting surfaceof the flange.

In some embodiments, the electronic device can further include one ormore thermal spreaders disposed adjacent to the first surface of thebody. The electronic device can further include a fan disposed adjacentto the portion of the body that does not include the matrix ofcontinuous passageways.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 shows a perspective view of an electronic device.

FIG. 2 shows an exploded view of the electronic device of FIG. 1.

FIG. 3 shows a perspective view of an electronic device.

FIG. 4 shows an exploded view of the electronic device of FIG. 3.

FIG. 5 shows a perspective view of an electronic device.

FIG. 6 shows an exploded view of the electronic device of FIG. 5.

FIG. 7 shows a perspective view of an electronic device.

FIG. 8 shows an exploded view of the electronic device of FIG. 7.

FIG. 9 shows a perspective view of an electronic device.

FIG. 10A shows a perspective view of a portion of a three-dimensionalstructure.

FIG. 10B shows a top view of the portion of a three-dimensionalstructure.

FIG. 10C shows a rear view of the portion of the three-dimensionalstructure of FIG. 10B.

FIG. 10D shows a front view of the portion of the three-dimensionalstructure of FIG. 10B.

FIG. 10E shows a cross-sectional view of the portion of thethree-dimensional structure of FIG. 10B.

FIG. 10F shows a perspective view of the spherical recesses of thethree-dimensional structure of FIG. 10B.

FIG. 11 shows a perspective view of a portion of a three-dimensionalstructure.

FIG. 12 shows a top view of the three-dimensional structure of FIG. 11.

FIG. 13 shows a side view of the three-dimensional structure of FIG. 11.

FIG. 14 shows a sectional view of the three-dimensional structure ofFIG. 11.

FIG. 15 shows a sectional view of an electronic device including athree-dimensional structure.

FIG. 16 shows a perspective view a three-dimensional structure for anelectronic device.

FIG. 17 shows a back view of a three-dimensional structure including acomparative thermal map showing heat flow in a three-dimensionalstructure and a solid body.

FIG. 18 shows a sectional view of a stage of a process for forming athree-dimensional structure.

FIG. 19 shows a sectional view of a stage of a process for forming athree-dimensional structure.

FIG. 20 shows a sectional view of a stage of a process for forming athree-dimensional structure.

FIG. 21 shows a sectional view of a three-dimensional structure formedaccording a process.

DETAILED DESCRIPTION

Representative embodiments are illustrated in the accompanying drawings.The following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, they are intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

The present structure includes a housing or other component includingregions of a three-dimensional structure. The three-dimensionalstructure can include spherical recesses that interfere with each otherto create through holes arranged in specified patterns. The sphericalrecesses can have a base form of three spherical recesses in a commonplane that at least partially intersect or interfere with one another,and a fourth spherical recess on an adjacent plane that intersects orinterferes with each of the three spherical recesses. This base form canthen be propagated or repeated throughout the structure to form theaggregate three-dimensional structure. The present three-dimensionalstructures, for example when included as a portion or region of ahousing, can provide a number of desirable attributes or properties tothe housing. Specifically, a housing including a structure as describedherein can provide enhanced heat removal compared to traditionalhousings. For example, a housing including the present structures canmaximize both surface area and aperture distribution for thermaltransfer, while maintaining a robust structural lattice. That is, ahousing including the present structures can optimize its ability todistribute or remove heat from an electronic device while remaining bothlight and strong, thereby improving performance of the electronic devicecompared to traditional monolithic or closed contiguous structures. Insome cases, the structure as described herein can be included as one ormore portions or regions of a housing or other components of anelectronic device. In some other cases, however, the structure can formsubstantially all of the housing and/or other components of anelectronic device.

The three-dimensional structure or structures included as a portion orregion of a housing for an electronic device can include a body defininga first surface and a second surface. In some examples, the body can bea unitary body, for example a unitary body formed by a single piece,section, or portion of a material. In some examples, however, the bodycan be formed from, or can include, two or more portions that can bejoined together to form the body, for example by welding, adhering, orbonding. In some examples, one or more cavities, or portions ofcavities, can be formed in separate portions of material, whereupon theportions of material can be joined to form a body including patterns ofcavities, as described herein. The first surface and the second surfaceof the body can be opposing surfaces. At least a portion of the body caninclude a three-dimensional pattern or matrix of apertures orpassageways therein. In some embodiments, the three-dimensional patterncan extend through at least a portion or region of the body orsubstantially throughout the entire body. The three-dimensional patterncan extend across one or more of an entire height, width, and depth ofthe body. The three-dimensional pattern or matrix can be formed ordefined by a combination of one or more cavities extending into the bodyfrom the first surface and one or more cavities extending into the bodyfrom the second surface of the body.

In some embodiments, the one or more cavities extending into the bodyfrom the first surface can intersect with one or more of the cavitiesextending into the body from the second surface, to form thethree-dimensional pattern or matrix. That is, in some cases, thenegative space of a cavity extending into the body from the firstsurface of the body can intersect or interfere with the negative spaceof one or more cavities extending into the body from the second surfaceof the body. Further, in some embodiments, the cavities caneccentrically intersect, merge, or interfere to form an aperture. Theaperture or apertures can be through-holes in the body, that is, as usedherein, the term aperture can refer to a hole in a body that passesentirely through the body. In some embodiments, the three-dimensionalpattern of apertures as described herein can have a surface area that isup to twice as large, up to five times as large, up to ten times aslarge, or even several orders of magnitude larger than the surface areaof a similarly sized and shaped body that does not include thethree-dimensional pattern of apertures. This high amount of surface areacan serve to greatly increase the ability of the body to transport heataway from itself or away from other components of an electronic devicein contact with the body, for example, by direct convection to thesurrounding air. In some embodiments, the cavities extending into thebody from a surface of the body can be arranged in a pattern. Thispattern can be a regular or repeating pattern of cavities that extendsthroughout a portion of a surface, or in some cases substantially anentire surface of the body.

The structures described herein, such as the three-dimensionalstructures for electronic devices, can provide for enhanced heat removalcompared to traditional three-dimensional structures. For example, athree-dimensional structure acting as a housing for an electronic devicecan remove relatively large amounts of heat from the electronic devicevia passive heat transfer to air surrounding the three-dimensionalstructure by maximizing surface area and providing apertures orpassageways that allow air to be driven into or through the device, forexample by a fan, to remove even more heat from the electronic device.These enhanced levels of heat removal, as described above, can result insignificant performance gains for the electronic device and can allowfor the use of components or operating levels that heretofore may nothave been achievable with existing three-dimensional structures.

The structures described herein can enhance characteristics of otheraspects of the electronic devices with which they are associated. Forexample, when used as a housing or other structural component of anelectronic device, a three-dimensional structure as described herein canprovide a high level of strength and stiffness to weight ratio to thedevice. Traditional structures often achieve enhanced stiffness orstrength by thickening or enlarging certain portions of the structure,often resulting in an increase in the weight and size of the electronicdevice, which may not be desirable to a user. The three-dimensionalstructures described herein can include, for example, a matrix ofpassageways that serves to greatly enhance the stiffness of thethree-dimensional structure, without significantly increasing the sizeor weight of the structure. Thus, a relatively lightweight, yetextremely strong and stiff electronic device can be produced.

The light weight and stiffness of the three-dimensional structure canalso provide a user with a pleasing experience when handling the device.While light weight, the three-dimensional structure is sufficientlyrigid and tough to allow the electronic device to be used over a longperiod of time while maintaining dimensional stability. Additionally,the present structure allows for custom designs to be 3D printed ormanufactured that optimize a number of factors including weight,rigidity, heat transfer considerations, and manufacturability. In somecases, a three-dimensional structure can include a relatively intricaterepeating pattern that, in addition to enhancing heat removalcapabilities and providing stiffness, provides a visually interesting oraesthetically pleasing effect to the user. Such a three-dimensionalstructure, for example when used as a housing, can also include avariety of colors on one or more regions of the housing to enhance thevisual appearance and provide a pleasing aesthetic experience to theuser.

Further, in some embodiments, the three-dimensional structures describedherein can act as shielding for the electronic device, while stillallowing for air flow there through. For example, in some cases, athree-dimensional structure can act as an electromagnetic interference(EMI) and/or electromagnetic compatibility (EMC) noise shield for one ormore components housed therein. In some embodiments, such as where thethree-dimensional structure includes a metal and/or conductive material,the structure can provide EMI and/or EMC shielding for one or moreelectronic components of the device, such as integrated circuits. Thus,in some cases, additional shielding material and/or measures may not beneeded to achieve a desired level of EMI and/or EMC shielding because ofthe three-dimensional structure. This beneficial shielding effect canthus reduce the cost and weight of a device, while providing otherenhanced characteristics, as discussed herein.

Any pattern or arrangement of cavities extending into the body from asurface is expressly contemplated, although in some embodiments thecavities may be arranged in a substantially uniform and regular pattern.For example, in some embodiments where the cavities extending into thebody from a surface have the shape of at least a portion of a sphere orhemisphere, the cavities may be arranged in a close-packed pattern, suchas a hexagonal close-packed pattern. In some embodiments, the cavitiesextending into the body from the first surface and the cavitiesextending into the body from the second surface can be arranged ordisposed in a pattern. The pattern of the cavities extending into thebody from the first surface can be the same as the pattern of cavitiesextending into the body from the second surface, although in someembodiments, the two patterns of cavities may not be the same. Asdescribed above with respect to the cavities extending into the bodyfrom the first and second surfaces intersecting to form thethree-dimensional pattern or matrix, the pattern of cavities extendinginto the body from the first surface can intersect or interfere with thepattern of cavities extending into the body from the second surface toproduce or define the three-dimensional pattern or matrix in the body.

In some embodiments, a structure can include or be formed from anymachinable or formable material. For example, in some embodiments athree-dimensional structure can include or be formed from a materialsuch as a metal, a ceramic, an amorphous material such as glass or anamorphous metal, a polymer, or combinations thereof. In someembodiments, a three-dimensional structure is a metal. In someembodiments, the metal can be an elemental metal or a metal alloy. Insome embodiments, the three-dimensional structure can include metalssuch as aluminum or steel. For example, the three-dimensional structurecan be aluminum or an aluminum alloy. In some embodiments, thethree-dimensional structure can include a 6000 series aluminum alloy,for example a 6060, 6061, or 6063 aluminum alloy. In some embodiments,for example where the three-dimensional structure includes a metaland/or conductive material, the structure can act as an EMC/EMI noiseshield

The structures described herein, for example as used in electronicdevices, can be formed by a variety of methods and processes. In someembodiments, a three-dimensional structure can be formed by etching,machining, casting, stamping, forging, forming, injection molding, orthe like. Further, multiple methods of forming structures can beemployed to form a single structure. For example, one or more cavitiesextending into the body from a first surface of the body of athree-dimensional structure can be formed by a stamping, molding, orforming process, while one or more cavities extending into the body froma second surface of the body of the three-dimensional structure can beformed by a machining or etching process.

In some embodiments, one or more methods of forming structures can beemployed multiple times to form the three-dimensional structure. Forexample, one or more cavities can be formed by machining the firstsurface, while additional cavities can be formed by machining the secondsurface. In some embodiments, for example, where the first and secondsurfaces are opposing surfaces, the body may be flipped or rotated afterthe first surface has been machined in order to machine the secondsurface. In some embodiments, the body may again be rotated to machinethe first and second surfaces additional times.

In some embodiments, three-dimensional structures can be formed by, forexample, stamping or forming the body to create one or more cavitiesextending into the body from the first surface. The second surface canthen be, for example, machined or etched to form one or more cavitiesextending into the body from the second surface, thereby created thethree-dimensional pattern of apertures. In some embodiments, a materialcan be added to the first and/or second surfaces after a first formingmethod to achieve a desired three-dimensional structure after a secondforming method has been carried out.

Alternatively or additionally, the structure can be formed by 3Dprinting methods. In some cases, for example, the structure can includea three-dimensional pattern or matrix of apertures that have a shape ordesign which is only possible to produce by a 3D printing process. Forexample, in some cases the structure can include one or more features orstructures such as blind holes or intricate patterns that can only beachieved by 3D printing the three-dimensional structure. Further,although the present structures are described herein as includingcavities extending from a first surface to intersect with cavitiesextending from a second surface, in some cases, the structure caninclude additional cavities or layers of cavities disposed between thecavities extending from the first or second surfaces. That is, in somecases the three-dimensional pattern of apertures or matrix ofpassageways can have a structure as described herein, but can have anynumber of additional cavities, or layers of cavities, disposed betweenthe cavities extending from the first and second surfaces.

As used herein with respect to cavities of a body, the termsintersecting or interfering refer to the negative space encompassed ordefined by one cavity, for example a continuous geometry defined atleast partially by a surface or body, overlapping with or protrudinginto the negative space encompassed or defined by a second cavity. Theterm eccentrically, as used herein, is defined broadly to include thegeometric definition of the term. For example where two spheresintersect and at least one of the spheres contains the geometric centerof both spheres. Broader definitions also can apply. For example, wheretwo bodies are not in line, that have centers or portions which do notalign, they would be considered eccentric or eccentrically alignedrelative to each other. Eccentric shall also include any non-concentric,non-coaxial orientation.

These and other embodiments are discussed below with reference to FIGS.1-21. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 shows an example electronic device 100 that can have a housing orother components including regions of the three-dimensional structuredetailed herein. The electronic device 100 shown in FIG. 1 is a displayor monitor, for example, as used with a computer. This is, however,merely one representative example of a device that can be used inconjunction with the ideas disclosed herein. The electronic device 100can, for example, correspond to a portable media player, a media storagedevice, a portable digital assistant (“PDA”), a tablet computer, acomputer, a mobile communication device, a GPS unit, a remote-controldevice, and the like. The electronic device 100 can be referred to as anelectronic device, or a consumer device. As shown, the electronic device100 can include any number of input devices such as a keyboard 110, amouse 120, a track pad, a stylus, a microphone, or any combination ofknown input devices. Further detail of the electronic device 100 isillustrated in FIG. 2.

Referring now to FIG. 2, the electronic device 100 can include a housing101 and a cover 103 attached to the housing 101. A number of internalcomponents 102 can be disposed between the housing 101 and the cover103. The housing 101 can substantially define at least a portion of anexterior surface of the device 100. The cover 103 can include glass,plastic, or any other substantially transparent material, component, orassembly. The cover 103 can cover or otherwise overlay a display, acamera, a touch sensitive surface such as a touchscreen, and the like,of the device 100. The cover 103 can define a front exterior surface ofthe device 100. Together the housing 101 and the cover 103 cansubstantially define the exterior surface of the device 100.

The device 100 can also include internal components 102, such asprocessors, memory, circuit boards, batteries, light emitting diodes(LEDs), fans, sensors, and other computer components. Such componentscan be disposed within an internal volume defined at least partially bythe housing 101 and can be affixed to the housing 101 via internalsurfaces, attachment features, threaded connectors, studs, posts, or thelike, that are formed into, defined by, or otherwise part of the housing101 and/or the cover 103.

The housing 101 can be formed from or can include regions having athree-dimensional structure as described herein. The three-dimensionalstructure, such as a three-dimensional structure formed in regions ofthe housing 101, can include a body having a first surface forming aportion of the exterior of the electronic device 100 and a secondsurface defining at least part of an internal volume of the housing 101.Additionally, other components of the electronic device 100, such asinternal structural components, can be formed from or can includeregions having a three-dimensional structure, as described herein. Thethree-dimensional structure, such as a three-dimensional structureformed in regions of the housing 101, can include one or more cavitiesextending into the body from a first surface of a body and one or morecavities extending into the body from a second surface of the body. Theone or more cavities extending into the body from the second surface ofthe body can intersect with or interfere with one or more cavitiesextending into the body from the first surface of the body to form athree-dimensional pattern of apertures or passageways in the body.

The body of a structure, for example a contiguous structure, can includeone or more structures formed in, defined by, or extending into the bodyfrom one or more of the surfaces of the body. For example, the body canhave a generally cuboid shape, a generally spherical shape, a generallycylindrical shape, a generally toroidal shape, and the like. In someexamples, the body can have a general shape of any polyhedron. In someother embodiments where the three-dimensional pattern extends throughone or more regions of the body, the regions can be separated by one ormore portions of the body that do not include the three-dimensionalpattern. The one or more portions separating the regions of the bodythat include the three-dimensional pattern can be substantiallycontinuous. In some embodiments, however, the one or more portions caninclude structures or features formed in or on the one or more portions.As used herein, the term three-dimensional pattern can refer to apositive surface of a three-dimensional structure, or a negative spaceat least partially enclosed or defined by a surface or body. Thethree-dimensional pattern can include one or more irregular shapes,regular shapes, repeating shapes, or combinations thereof. While FIG. 2illustrates a display or monitor, the present three-dimensionalstructure can be incorporated into any number of electronic devices, asillustrated in FIG. 3.

FIG. 3 shows another example electronic device 200. The electronicdevice shown in FIG. 3 is a phone, such as a smartphone. The smartphoneof FIG. 3 is merely one representative example of a device that can beused in conjunction with the systems and methods disclosed herein. Asdescribed with respect to electronic device 100, electronic device 200can correspond to any form of electronic device, such as a wearableelectronic device, a portable media player, a media storage device, aportable digital assistant (“PDA”), a tablet computer, a computer, amobile communication device, a GPS unit, a remote-control device, andthe like. The electronic device 200 can be referred to as an electronicdevice, or a consumer device. As shown, similar to the display ormonitor shown in FIG. 2, the phone 200 of FIG. 3 can generally include ahousing 201 and a cover 203. The housing 201 can be at least partiallyformed from or can include regions having a three-dimensional structure,as described herein. Further details of the electronic device 200 areprovide below with reference to FIG. 4.

Referring now to FIG. 4, the electronic device 200 can include a housing201, and a cover 203 attached to the housing. The housing 201 cansubstantially define at least a portion of an exterior surface of thedevice 200. The cover 203 can include glass, plastic, or any othersubstantially transparent material, component, or assembly. The cover203 can cover or otherwise overlay a display, a camera, a touchsensitive surface, such as a touchscreen of the device 200, or any otherinternal component. The cover 203 can define a front exterior surface ofthe device 200. Together the housing 201 and the cover 203 cansubstantially define the exterior surface of the device 200.

The device 200 can also include internal components, such as processors,memory, circuit boards, batteries, sensors, and other similar electronicand structural components. Such components can be disposed within aninternal volume defined at least partially by the housing 201 and can beaffixed to the housing 201 via internal surfaces, attachment features,threaded connectors, studs, posts, and the like, that are formed into,defined by, or otherwise part of the housing 201 and/or the cover 203.As shown, the device 200 can include a touch screen 204 disposedadjacent to the cover 203. Additionally, functional elements may becontained within the space defined by the housing 201 and the cover. Forexample, the device 200 may include a battery 206, a power module 208, avolume module 210, a mute module 212, a number of speakers 218, cameras216, haptic motors (not shown), circuit boards (not shown), and similarmodules or components disposed within the housing 201. Furthermore,access to the internal modules and components may be facilitated throughthe housing 201 via access ports 214 that enable the plugging of cablesfor power or data into the internal modules. Furthermore, volume buttons211, mute switches 213, and power buttons (not shown) can pass throughcorresponding openings formed in the housing 201.

As with the housing 101 of electronic device 100, the housing 201 can beformed from, can include regions having, or can be a three-dimensionalstructure as described herein. Additionally, other components of theelectronic device 200, such as internal structural components can beformed from, can include, or can have regions of a three-dimensionalstructure, as described herein. The three-dimensional structure, such asa three-dimensional structure forming regions of the housing 201, caninclude one or more cavities extending into the body from a firstsurface of a body and one or more cavities extending into the body froma second surface of the body. One or more cavities extending into thebody from the second surface of the body can intersect with or interferewith one or more cavities extending into the body from the first surfaceof the body to form a three-dimensional pattern of apertures orpassageways in the body, maximizing surface area while maintainingstructural integrity. In some examples, the three-dimensional structuremay initiate on an outer surface of the body, including cavities fromdifferent directions intersecting or interfering with one another,without extending to the innermost surface of the body. In theseexamples, many of the advantages discussed above relative to thethree-dimensional structure can be realized, such as strength, weightreduction, and thermal energy transfer, while maintaining a sealedinternal cavity of the electronic device 200. The three-dimensionalstructure forming the housing 201 or other component of the device 200can include one or more openings to receive components of the electronicdevice 200 and/or provide access to an internal portion of theelectronic device 200, such as a speaker 218, access port 214, muteswitch 212, volume button 211, and the like. Similarly, additionalelectronic devices, such as the computers shown in FIGS. 7-9, caninclude regions including the present three-dimensional structure.Additionally, while FIGS. 3 and 4 describe an outer housing havingregions including the three-dimensional structure, the structure may beused in other manners, as detailed in FIGS. 5 and 6.

FIG. 5 shows a device 300 in the form of a phone. As with the device 200of FIG. 3, the device 300 includes a housing 301 and a cover 303. Thedevice 300 of FIGS. 5 and 6, however, differs internally compared to thedevice 200 of FIGS. 3 and 4, as shown in FIG. 6.

FIG. 6 is an exploded view of the device 300 of FIG. 5. As shown, thedevice 300 can include a cover 303, a housing 301, and a back plate 312defining an internal area of the device. Any number of device componentscan be positioned within the internal area including a battery 314, aprocessor 313, a power module 315, and similar device components. Anynumber of the device components can be accessed via access ports 311formed in the housing 301 or the back plate 312. As shown, a cross-brace306 is diagonally disposed within the housing 301. According to oneexample, the cross-brace 306 can include regions having thethree-dimensional structure formed therein. According to this example,the cross-brace 306 can be sufficiently strong to prevent deformation ordeflection of the housing 301, while adding little weight, due to theregions having the three-dimensional structure formed therein. Anynumber of components of an electronic device can include regions havingthe three-dimensional structure formed therein, either for structuralenhancements, weight savings, or thermal energy transfer, as shown inFIG. 7 and described below.

FIG. 7 shows another example electronic device 400. The electronicdevice shown in FIG. 7 is a computer. As with electronic devices 100,200, and 300 discussed herein, the computer of FIG. 7 is merely onerepresentative example of a device that can be used in conjunction withthe systems and methods disclosed herein. Electronic device 400 cancorrespond to any form of electronic device, such as a wearableelectronic device, a portable media player, a media storage device, aportable digital assistant (“PDA”), a tablet computer, a computer, amobile communication device, a GPS unit, a remote-control device, andthe like. The electronic device 400 can be referred to as an electronicdevice, or a consumer device. The electronic device 400 can have anexterior housing 401 and a base portion 403. Further details of theelectronic device 400 are provided below with reference to FIG. 8.

Referring now to FIG. 8, the electronic device 400 can include a housing401 and, for example, a base portion 403 attached to the housing. Thehousing 401 can substantially define at least a portion of an exteriorsurface of the device 400. The base portion 403 can define a lower orbottom exterior surface of the device 400. Together the housing 301 andthe base portion 403 can substantially define the exterior surface ofthe device 400.

The device 400 can also include internal components, such as processors404, memory 406, circuit boards 407, batteries, sensors, speakers 405,and the like. Such components can be disposed within an internal volumedefined at least partially by the housing 401 and can be affixed to thehousing 401 via internal surfaces, attachment features, threadedconnectors, studs, posts, and the like, that are formed into, extendinginto the body from, or otherwise part of the housing 401 and/or the baseportion 403.

The device 400 can assume any number of form factors or configurations,such as the computing tower device 500 shown in FIG. 9. Similar to thedevice 400 shown in FIGS. 7 and 8, the computing tower device 500includes a housing 501 and a base portion 503. As illustrated, a portionof the housing 501 of the computing tower device 500 can include aregion having the three-dimensional structure, as described herein.

As with the housings 101, 201 of electronic devices 100 and 200, thehousings 401, 501 can be formed from, can include regions of, or can bea three-dimensional structure as described herein. Additionally, othercomponents of the electronic devices 400, 500, such as internalstructural components can be formed from, can include regions of, or canbe a three-dimensional structure as described herein. Thethree-dimensional structure, such as a three-dimensional structureforming regions of the housings 401, 501 can include one or morecavities extending into the body from a first surface of a body and oneor more cavities extending into the body from a second surface of thebody. One or more cavities extending into the body from the secondsurface of the body can intersect with or interfere with one or morecavities extending into the body from the first surface of the body toform a three-dimensional pattern of apertures or passageways in thebody. The three-dimensional structure forming the housings 401, 501 orother component of the devices 400, 500 can include one or more openingsto receive components of the electronic devices 400, 500 and/or provideaccess to an internal portion of the electronic devices 400, 500.Further details of the three-dimensional structure are provided belowwith reference to FIGS. 10A-14.

FIG. 10A is a perspective view of one example three-dimensional pattern.As shown, a plurality of top spherical recesses 654 can be formed in thetop surface 652 of the unitary body 650. The unitary body 650 caninclude a three-dimensional structure defined by a number of topspherical recesses 654 that extend from the top surface 652 and engageand interfere with a number of bottom spherical recesses 656 formed inthe bottom surface (FIG. 10C). The top spherical recesses 654 and thebottom spherical recesses 656 can interfere with each other to createthrough holes arranged in specified patterns. FIGS. 10B through 10E showthe three-dimensional pattern of the unitary body 650 in variousorientations.

FIG. 10B is a top view of the example three-dimensional pattern formedin the unitary body 650. As shown, the top spherical recesses 654 formedin the top surface 652 of the unitary body 650 extend through and createthrough holes due to their engagement and interference with the bottomspherical recesses 656. The front, rear, and cross-sectional views shownin FIGS. 10C, 10D, and 10E, respectively, illustrate the through holescreated by the engagement of the top spherical recesses 654 and thebottom spherical recesses 656. According to one example, the use ofspherical recesses increases the exposed surface area of thethree-dimensional pattern, enhancing the thermal transfer capabilitiesvia convection. The three-dimensional pattern shown in FIGS. 10A-10E canbe a pattern aggregation of a base pattern of orifices or recessesformed in the unitary body 650. One example base orifice pattern isshown in FIG. 10F and described in further detail below.

As mentioned above, the spherical recesses can have a base pattern ofthree spherical recesses disposed in a common plane and at leastpartially intersecting or interfering with one another, and a fourthspherical recess on an adjacent plane that intersects or interferes witheach of the three spherical recesses. FIG. 10F graphically illustratesone example of a base pattern 660 of the spherical recesses. The basepattern 660 can include a first spherical recess 662, a second sphericalrecess 664, and a third spherical recess 666 arranged in a first planeand at least partially intersecting one another, as shown by theintersection line 670. The areas of intersection of the cavities resultin through holes in the resulting unitary body containing thethree-dimensional pattern. A fourth spherical recess 670 is disposed ina different plane relative to the first spherical recess 662, the secondspherical recess 664, and the third spherical recess 666. Asillustrated, the fourth spherical recess 670 can intersect the firstspherical recess 662, the second spherical recess 664, and the thirdspherical recess 666, as shown by the intersection line 670, therebyforming the through holes in the unitary body. According to one examplethe first spherical recess 662, the second spherical recess 664, and thethird spherical recess 666 can be top spherical recesses originating ata top surface of a unitary body and the fourth spherical recess 668 canbe a bottom spherical recess originating at a bottom surface of theunitary body, to form the three-dimensional pattern. This base form orpattern 660 can then be repeated and propagated throughout thestructure, in various patterns or geometric arrangements, to form theaggregate three-dimensional structure.

FIG. 11 illustrates a perspective view of a portion of athree-dimensional structure 600 as described herein. Thethree-dimensional structure 600 includes a body 602, which in someembodiments can be a unitary body. The body 602 includes at least afirst surface 604 and a second surface 606. In some embodiments, thefirst surface 604 and the second surface 606 can be opposing surfaces ofthe body 602. For example, in some embodiments, the first surface 604can be parallel to and opposing the second surface 606. In someembodiments, however, the first surface 604 and second surface 606 maynot be substantially parallel or opposed and can be adjacent to eachother or disposed relative to one another at any angle. As shown in FIG.11, first cavities 614 and second cavities 616 can be formed in the body602. The cavities can be formed by any manufacturing process including,but not limited to, machining, forming, etching, 3-D printing, or anycombination thereof. Further detail of the cavities in variousorientations is provided below with reference to FIGS. 12 and 13.

Referring now to FIG. 12, which illustrates a top view of the firstsurface 604 of the body 602, one or more first cavities 614 or recessescan be extending into the body from the first surface 604. The firstcavities 614 can have substantially the same size and shape as oneanother, although in some embodiments the first cavities 614 can vary insize and shape from one another. The first cavities 614 can have asubstantially spherical or hemispherical shape, such that the negativespace of a cavity 614 can have a shape of a portion or region of asphere. In some other embodiments, however, the first cavities 614 canhave any shape. As can be seen, the first cavities 614 can be arrangedin a pattern, for example a regular or repeating pattern of firstcavities 614. In some embodiments, the pattern can include aclose-packed pattern of substantially spherical first cavities 614, forexample a hexagonal close-packed pattern of substantially sphericalfirst cavities 614. As used herein, a hexagonal close-packed pattern isintended to be understood as a structure that substantially correspondsto a layer of spheres or portions of spheres packed so that spheres orportions of spheres in alternating layers overlie one another, alignedin the gaps of the preceding layers. As described above, the presentsystem can not only overlie one another, but can interfere or overlapthe adjacent spheres. A traditional packing factor for hexagonal closepacked systems is typically 0.74, though it can be higher in the presentsystem due to the overlapping or interference pattern created. Accordingto one example, the close packed pattern is established by repeating andpropagating the base pattern detailed in FIG. 10F throughout thestructure, in various patterns or geometric arrangements, to form theaggregate three-dimensional structure.

FIG. 13 illustrates a top view of the second surface 606 of the body602, which in this example, opposes the first surface 604. In someembodiments, one or more second cavities 616 can be extending into thebody from the second surface 606. The second cavities 616 can havesubstantially the same size and shape as one another, although in someembodiments the second cavities 616 can vary in size and shape from oneanother. The second cavities 616 can have a substantially spherical orhemispherical shape, such that the negative space of a cavity 616 canhave a shape of a portion or region of a sphere. In some otherembodiments, however, the second cavities 616 can have any shape. As canbe seen, the second cavities 616 can be arranged in a pattern, forexample a regular or repeating pattern of second cavities 616. In someembodiments, the pattern can include a close-packed pattern ofsubstantially spherical or hemispherical second cavities 616, forexample a hexagonal close-packed pattern of substantially sphericalsecond cavities 616.

In some embodiments, the pattern of second cavities 616 extending intothe body from the second surface 606 can be substantially similar to thepattern of first cavities 614 extending into the body from the firstsurface 604. In some other embodiments, however, the patterns of firstand second first cavities 614, 616 can be different. In someembodiments, and as illustrated in the section view of thethree-dimensional structure 600 shown in FIG. 10, the pattern of firstcavities 614 and the pattern of second cavities 616 can be substantiallysimilar but can be laterally offset or displaced from one another.

As further illustrated in FIG. 14, at least one first cavity 614extending into the body from the first surface 604 can intersect orinterfere with at least one second cavity 616 extending into the bodyfrom the second surface 606. In some embodiments, one or more firstcavities 614 can intersect with one or more second cavities 616.Further, one or more first cavities 614 can intersect with differentnumbers of second cavities 616. For example, in some embodiments, anamount of the first cavities 614 can each intersect with three secondcavities 616 while an amount of different first cavities 614, forexample those first cavities 614 positioned near a periphery of the body602, can each intersect with two second cavities 616.

Similarly, in some embodiments, one or more second cavities 616 canintersect with one or more first cavities 614. Further, one or moresecond cavities 616 can intersect with different numbers of firstcavities 614. For example, in some embodiments, an amount of the secondcavities 616 can each intersect with three first cavities 614 while anamount of different second cavities 616, for example those secondcavities 616 positioned near a periphery of the body 602, can eachintersect with two first cavities 614.

Together, the intersecting first cavities 614 and second cavities 616form or define the three-dimensional pattern of apertures 608 extendingthrough the body 602. In some embodiments, at least some of theapertures 608 of the three-dimensional pattern can be in fluidcommunication with one another to form or define a matrix of continuouspassageways in the body 602. In some embodiments, this matrix ofpassageways can extend substantially throughout the entire body 602 suchthat any one cavity can be in fluid communication with any other cavityvia the passageways. Additionally, the three-dimensional pattern ofapertures 608 maintains a structural lattice of the material forming thebody 602. This resultant lattice structure provides thermal benefits inthat there is an increased surface area for the transmission and releaseof thermal energy via convection as compared to traditional patterns,while providing passageways for convective transfer of thermal energy.Additionally, the interconnected lattice structure provides structuralsupport for the body 602. Further details of how the three-dimensionalpattern of apertures 608 can be incorporated into an electronic devicewill be provided below with reference to FIG. 15.

FIG. 15 shows a sectional view of an electronic device 700, such as adisplay, including a housing 701 that is formed from a three-dimensionalstructure 702 as described herein. The three-dimensional structure 702can be substantially similar to the portion of three-dimensionalstructure 600 described with respect to FIGS. 11-14. That is, in someembodiments, the three-dimensional structure can include a body 703including a first surface 704 and a second surface 706 opposing thefirst surface 704. In some embodiments, the first and second surfaces704, 706 can be generally rectangular, although the surface can be anyother shape. The body can include a pattern of first cavities 714extending into the body from the first surface 704 and a pattern ofsecond cavities 716 extending into the body from the second surface 706.One or more of the first cavities 714 can intersect with one or more ofthe second cavities 716 to form or define a three-dimensional pattern ofapertures 708, such as a three-dimensional matrix of continuouspassageways

In some embodiments, the body 703 can include additional structure orfeatures. For example, as shown in FIG. 15, the body 703 can include aflange 720 that extends away from a surface of the body 703, such as thefirst surface 704. Together, the flange 720 and the first surface 704can define an internal volume of the electronic device 700. The flange720 can include one or more mounting surfaces for components of theelectronic device. In some embodiments, the flange 720 can include amounting surface 722 that can receive a display 730. The electronicdevice can further include a cover 731 that can define a front exteriorsurface of the electronic device 700 and that, together with the housing701, can substantially define the exterior surface of the device 700. Insome embodiments, other components, such as LEDs and their associatedcontrollers 740 can be disposed within the internal volume of the device700.

In some embodiments, the electronic device 700 can also include one ormore thermal spreaders 750 disposed near, substantially adjacent to, orin contact with the body 703. The thermal spreaders 750 can also bedisposed substantially near, adjacent to, or in contact with one or morecomponents of the device 700, such as the LEDs and controllers 740. Forexample, in some cases, a thermal spreader 750 can contact one or morecomponents, such as LEDs and controllers 740. In some other cases,however, a thermal spreader 750 does not directly contact a componentand an air gap can be present between the component and the thermalspreader 750. In some cases, this air gap can be less than about amillimeter, or can be about several millimeters, or more. The thermalspreaders can include or be formed from materials having high thermalconductivity, for example materials such as carbon (e.g., in the form ofgraphite/graphene) or metals such as copper or aluminum. Bysubstantially bridging a space between the body 703 and one or morecomponents of the device 700, a thermal spreader 750 can facilitate thetransfer of heat generated by the component to the three-dimensionalstructure 702 of the housing 701 where it can be efficiently andeffectively removed from the device, for example, by conduction asdiscussed herein. A thermal spreader 750 can also serve to evenlydistribute heat generated in a relatively small location, for example,by a component such as an LED, over a much larger area, for example thearea of the spreader itself. In addition to facilitating the removal ofheat from the device 700, the ability of the thermal spreader 750 todistribute heat can prevent the formation of hotspots in the device 700and further allow for increased device performance. As the heat istransferred to the three-dimensional structure 702, it can exit thedevice 700, as detailed with reference to FIG. 16 below.

FIG. 16 shows a perspective view a three-dimensional structure 802 usedto form a housing 801 for an electronic device 800. The electronicdevice 800 can be, for example, a display or monitor, although thecomponents of the device 800 are not depicted in FIG. 16. Thethree-dimensional structure 802 can include a body 803, such as aunitary body of aluminum. The body 803 can include a three-dimensionalpattern of apertures 808 that are formed by the intersection of one ormore first cavities 814 extending into the body from a first surface 804of the body 803 and one or more second cavities extending into the bodyfrom a second surface 806 of the body 803 as discussed herein.

The three-dimensional pattern of apertures 808 can include two or moreregions that are separated by one or more portions of the body that doesnot include the three-dimensional pattern of apertures 808. For example,a portion of the body 810 extending substantially across an entire widthof the body 803 can separate two regions of the pattern of apertures808. In some embodiments, the portion of the body 810 can furtherinclude structures or features for mounting or housing components of theelectronic device 800. In some embodiments, for example, one or morefans 820 can be mounted to the housing 801 at or adjacent to the portionof the body 810.

In some embodiments where a fans 820 are positioned at or adjacent tothe portion of the body 810, the fan or fans can drive airflow into, outof, and through the housing 801 of the device 800. An airflow pathway isillustrated in FIG. 16 by arrows 830. In some embodiments, and asillustrated, a fan 820 can pull air into an internal volume defined bythe housing 801 through the pattern of apertures 808. Air can be pulledin from one or more of the regions of the pattern of apertures 808. Therelatively large number of apertures 808, and in some embodiments thematrix of continuous passageways, can allow for relatively large amountsof air to be pulled into the device 800 as compared to electronicdevices including traditional housings. The air can be pulled to acentral location on the housing 801, traveling past one or morecomponents of the electronic device 800. The components can transferheat to the flowing air, for example by direct convection. The nowheated air can then be driven out of the device 800 through the patternof apertures 808 to facilitate the removal of excess heat from thedevice 800. In some embodiments, air can be exhausted via one ormultiple regions of the pattern of apertures 808. For example, in someembodiments, the air can be exhausted primarily via a lower region ofthe pattern of apertures 808 as illustrated.

One airflow pattern to remove heat from the electronic device 800 isillustrated by the arrows in FIG. 16, although other airflow patternsare expressly contemplated. Further, heat can also be removed from thedevice 800 via buoyancy driven airflow through the pattern of apertures808 as discussed herein. As the airflow patterns are developed, thethermal properties of each given structure can be established, as shown,for example, in FIG. 17.

FIG. 17 illustrates a comparative thermal map showing thermal flow in athree-dimensional structure 902 including a pattern of apertures 908 anda similarly proportioned solid body 920 that does not include a patternof apertures 908. A back view of the three-dimensional structure 902 isillustrated. Such a three-dimensional structure 902 can, for example, beused to form a housing of an electronic device. The thermal map has beenshaded such that both the three-dimensional structure 902 and the solidbody 920 are used as a housing for an identical electronic device, suchas a display, that includes a variety of components in an internalvolume defined by the housing. These components generate thermal energythat must be effectively removed from the device by the housing in orderto achieve maximum device performance. The three-dimensional structure902 and the body 920 have been shaded such that darker areas indicatehigher levels of thermal energy. Residual thermal energy can beproblematic in an electronic device, such as creating problems for theelectronic components and negatively affecting efficiency. Accordingly,it can be beneficial for a housing to effectively remove large amountsof thermal energy from the device while remaining relatively cool.

As can be seen from the thermal map, the three-dimensional structure 902has both a lower average temperature and a lower maximum temperaturethan the body 920. For example, the three-dimensional structure 902 canhave an average temperature that is more than about 0.5%, more thanabout 1%, or more than about 1.5% or more lower than the averagetemperature of the solid body 920. Further, the three-dimensionalstructure 902 can have a maximum temperature that is more than about0.5%, more than about 1%, or more than about 1.5% or more lower than themaximum temperature of the solid body 920.

Even though the three-dimensional structure 902 is cooler than the solidbody 920, the rear of the three-dimensional structure 902 can still havea higher rate of heat flow than the solid body 920, for example due tothe pattern of apertures 908 in the three-dimensional structure 902, theincreased surface area relative to a planar body and defined channels.In some embodiments, the rear of the three-dimensional structure 902 canhave a flow of thermal energy that is more than about 5%, more thanabout 10%, or more than about 15% or more than the solid body.Similarly, the three-dimensional structure 902 can have a highercapacity for thermal energy transfer than the solid body 920. That is,even though the three-dimensional structure maintains a lower housingtemperature than the body 920, the three-dimensional structure 902 canremove a larger amount of thermal energy from the device than the solidbody 920. In some embodiments, the three-dimensional structure 902 canhave a heat transfer capacity that is more than about 5%, more thanabout 10%, more than about 15%, more than about 20%, or more than about25% or more than the solid body 920. While described in terms of amachined unitary body, the three-dimensional structure 902 canalternatively be stamped or formed in a number of different ways,including those illustrated in FIGS. 18-21 and described below.

FIG. 18 illustrates a sectional view of a stage of a process for forminga three-dimensional structure 1000. The three-dimensional structure 1000can include a body 1002 that can be provided, for example, as a unitaryportion of substantially flat material. The body 1002 can include afirst surface 1004 and a second surface 1006 as discussed herein. Insome embodiments, the body 1002 can be any machinable material and/orformable material. In some embodiments, the body 1002 can be a metal, aceramic, an amorphous material such as glass or an amorphous metal, apolymer, or combinations thereof. In some embodiments, the body 1002 canbe a metal, such as aluminum or an aluminum alloy. In some embodiments,the body 1002 can be a 6000 series aluminum alloy, for example a 6060,6061, or 6063 aluminum alloy.

FIG. 19 shows a sectional view of a stage of a process for a forming athree-dimensional structure 1000 from the body 1002, for example asdepicted in FIG. 18. The first surface 1004 of the body 1002 can besubjected to a method of forming structure. In some embodiments, themethod of forming structures can form one or more first cavities 1014,for example a pattern of first cavities 1014, extending into the bodyfrom the first surface 1004. In some embodiments, and as illustrated inFIG. 19, the first cavities 1014 can be formed by a forming or stampingprocess, whereby the body 1002 can be deformed and/or molded to createthe first cavities 1014. In some embodiments, the first cavities 1014can be formed by other methods as discussed herein, for example bymachining the first surface 1004.

In some embodiments, the second surface 1006 can then be subjected to amethod of forming structure as discussed herein. In some embodiments,the method of forming structures can form one or more second cavities1016, for example a pattern of second cavities 1016, extending into thebody from the second surface 1006. The method used to form the secondcavities 1016 can be a same or similar method to the method used to formthe first cavities 1014. In some embodiments, the method used to formthe second cavities 1016 can be a different method than the method usedto form the first cavities 1014. For example, in some embodiments thefirst cavities 1014 can be formed by a stamping or forming process whilethe second cavities 1016 can be formed by a machining or etchingprocess. The formed second cavities 1016 intersect with the firstcavities 1014 to define a three-dimensional pattern of apertures 1008 inthe body 1002 as discussed herein.

FIG. 16 shows a sectional view of a stage of a process for forming athree-dimensional structure 1002. In some embodiments, portions of thebody 1002 that may not include cavities 1014, 1016 or a pattern ofapertures can be formed into one or more structures or features by oneor more methods. For example, peripheral portions of the body 1002 canbe stamped or formed to create a flange 1020 extending away from thefirst surface 1004 of the body 1002. In some embodiments, the flange1020 and the first surface 1004 can define an internal volume. The oneor more methods used to form structures or features, for example flange1020, can be carried out before, after, or during the methods used toform cavities 1014, 1016 in the first and/or second surfaces 1004, 1006.

FIG. 21 shows a sectional view of a three-dimensional structure 1002formed according to a process. In some embodiments, the body 1002 can besubjected to one or more methods to form structures or features such asone or more mounting surfaces 1022 for components of an electronicdevice. The methods for forming such structures 1022 can include forgingor pressing at least a portion of the body 1002, although any method offorming the body as discussed herein can be used. In some embodiments,the structure or structures 1022 can include attachment features,threaded connectors, studs, posts, or the like, that are defined by thebody 1002. The final formed three-dimensional structure 1000 includingthe body 1002 can thereafter be used as, for example, a housing for anelectronic device as discussed herein.

While the present disclosure generally describes the three-dimensionalstructure as including negative space of a spherical cavity extendinginto a body from a first surface of the body and intersecting orinterfering with the negative space of one or more spherical cavitiesextending into the body from the second surface of the body, thecavities described with any of the embodiments detailed above can assumeany geometric shape, pattern, size, or combination of shapes, patterns,and sizes. Additionally, in some examples, the smaller feature patternsof the three-dimensional structures can be selectively oriented andcombined into a larger feature pattern that can be repeated throughout abody.

Various inventions have been described herein with reference to certainspecific embodiments and examples. However, they will be recognized bythose skilled in the art that many variations are possible withoutdeparting from the scope and spirit of the inventions disclosed herein,in that those inventions set forth in the claims below are intended tocover all variations and modifications of the inventions disclosedwithout departing from the spirit of the inventions. The terms“including:” and “having” come as used in the specification and claimsshall have the same meaning as the term “comprising.”

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not meant to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a body having afirst surface and a second surface opposite the first surface; the bodydefining a first pattern of first cavities extending into the body fromthe first surface; and the body defining a second pattern of secondcavities extending into the body, the second cavities intersecting withthe first cavities to form a pattern of apertures in fluid communicationwith one another; the body defining the pattern of apertures that extendsubstantially across a major dimension of the body, the body having atleast two regions separated by a substantially continuous portion of thebody.
 2. The electronic device of claim 1, wherein: the pattern ofapertures extend substantially across a length of the body.
 3. Theelectronic device of claim 1, wherein: the second cavities extend intothe body from the second surface; and the second cavities intersectingwith the first cavities are nonconcentric and non-coaxial to the firstcavities.
 4. The electronic device of claim 1, wherein the first orsecond pattern is a repeating pattern of cavities.
 5. The electronicdevice of claim 1, wherein the first cavities are substantially a samesize as the second cavities.
 6. The electronic device of claim 1,wherein the first cavities and the second cavities are substantiallyspherical.
 7. The electronic device of claim 1, wherein the firstcavities and the second cavities are substantially positioned in aclose-packed arrangement.
 8. The electronic device of claim 1, whereinthe first cavities and the second cavities are substantially positionedin a hexagonally close-packed arrangement.
 9. The electronic device ofclaim 1, wherein the body conducts heat away from a component positionedsubstantially adjacent to the second surface.
 10. The electronic deviceof claim 1, wherein the body has a thickness of less than about 15 mm.11. The electronic device of claim 1, wherein the body comprises ametal.
 12. A housing for an electronic device, comprising: a body havinga first surface and a second surface; the body defining first cavitiesextending into the body; the body defining second cavities extendinginto the body and eccentrically intersecting the first cavities to forma pattern of connected through-holes; the body comprising: a firstregion comprising the pattern of connected through-holes; a secondregion comprising the pattern of connected through-holes; and a thirdregion separating the first region from the second region, the thirdregion comprising a substantially continuous portion of material. 13.The housing of claim 12, wherein the first first cavities aresubstantially a same shape as the second cavities.
 14. The housing ofclaim 12, wherein the first cavities and the second cavities aresubstantially spherical.
 15. The housing of claim 12, wherein the bodyat least partially defines an internal volume configured to surround acomponent of the electronic device.
 16. An electronic device,comprising: a body having a first surface and a second surface oppositethe first surface; the body defining a first repeating pattern ofsubstantially spherical first cavities extending into the body from thefirst surface; the body defining a second repeating pattern ofsubstantially spherical second cavities extending into the body, asecond cavity eccentrically interfering with a first cavity to form amatrix of continuous passageways; the body defining the matrix ofcontinuous passageways that extend substantially across a width of thebody, the body having at least two regions separated by a substantiallycontinuous portion of the body; and a display coupled to the body. 17.The electronic device of claim 16, further comprising a thermal spreaderdisposed adjacent to the first surface.
 18. The electronic device ofclaim 16, further comprising a fan disposed adjacent to the portion ofthe body that does not include the matrix of continuous passageways. 19.The electronic device of claim 16, wherein the first repeating patterncomprises: three substantially spherical first cavities all intersectingon a first plane; and a fourth substantially spherical cavity disposedon a second plane intersecting each of the three substantially sphericalfirst cavities.